The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.
The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.
Patent No.:
Date of Patent:
Jun. 16, 1992
Filed:
Mar. 14, 1990
NGK Insulators, Ltd., , JP;
Abstract
A ceramic lid for sealing a semiconductor element and having a sealing surface which is to seal a semiconductor element within a recess of a ceramic package, by heating the recess with glass sealant and hermetically sealing the semiconductor element. The ceramic lid is made of alumina of high purity and to the sealing surface of the ceramic lid is applied a glass sealing aid which is pretreated at a higher temperature than the heating temperature for sealing the semiconductor element, before hermetically sealing the semiconductor element in the ceramic package. A method of manufacturing a ceramic lid for sealing a semiconductor element includes the steps of manufacturing the ceramic lid with alumina of high purity having a sealing surface with the recess of the ceramic package, wherein to the sealing surface of the ceramic lid is applied a glass sealing aid of 5-30 .mu.m in thickness onto a sealing surface of the ceramic lid with the ceramic package. The ceramic lid is heat-treated at a higher temperature than the sealing temperature of the semiconductor element. Thereafter a glass sealant is applied and dried on the glass sealing aid layer, and then calcined at a temperature lower than the airtight sealing temperature of the semiconductor element, thereby removing an organic binder contained in the glass sealant. A semiconductor element is then housed within a recess of the ceramic package and the ceramic lid and a glass sealant are heated to hermetically seal the ceramic lid with the semiconductor element in the recess to the ceramic package.