The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.

The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.

Date of Patent:
Jun. 09, 1992

Filed:

Dec. 29, 1989
Applicant:
Inventors:

Richard F Frankeny, Elgin, TX (US);

Karl Hermann, Austin, TX (US);

Attorney:
Primary Examiner:
Int. Cl.
CPC ...
H05K / ;
U.S. Cl.
CPC ...
361413 ; 174261 ; 361388 ; 361396 ; 361414 ; 439 74 ;
Abstract

A multi-level circuit structure is provided which includes a plurality of overlying substrates, each having at least one conductive core. A plurality of imprinted depressions are formed in each substrate, each depression having a convex surface and a concave surface. Dielectric coatings are utilized to provide insulation between adjacent substrates and by selectively placing a conductive mass between selected overlying imprinted depressions an electrical connection may be formed between adjacent imprinted depressions wherein selected portions of one substrate may be electrically coupled to selected portions of a second substrate.


Find Patent Forward Citations

Frankeny, Richard. (1992). Multi-level circuit structure utilizing conductive cores having (U.S. Patent No. 5121299). U.S. Patent and Trademark Office. https://idiyas.com/patent/badge/5121299

Data source: USPTO (United States Patent and Trademark Office) public patent records. Weekly synchronization. How IDiyas builds this profile

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