The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.
The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.
Patent No.:
Date of Patent:
Jun. 09, 1992
Filed:
Aug. 08, 1991
Alfred S Conte, Hollister, CA (US);
Sun Microsystems, Inc., Mountain View, CA (US);
Abstract
A Tape Automated Bonding (TAB) process prepared multi-chip module (MCM) has semiconductor dice embedded into the substrate of the MCM through its top face. A heatsink, which in a preferred embodiment is a copper slug, is emplaced into the underside of the substrate so that the bottom surfaces of the dice engage the heatsink. A compliant, heat-conducting thermoplastic material is used to secure the dice to the heatsink and to maintain a good heat flow path. According to the present invention, the TAB formed component has beam leads that do not require bending to facilitate assembly. Rather, the beam leads are trimmed to length, leaving straight outer beam leads that, after the die is installed in the substrate, extend parallel to and overlie the top face of the substrate. The beam leads are thus positioned for convenient bonding to signal paths laid out on the top face of the substrate.