The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.
The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.
Patent No.:
Date of Patent:
Jun. 09, 1992
Filed:
Oct. 30, 1990
Applicant:
Inventor:
Kazuhiko Niwayama, Fukuoka, JP;
Assignee:
Mitsubishi Denki Kabushiki Kaisha, Tokyo, JP;
Primary Examiner:
Assistant Examiner:
Int. Cl.
CPC ...
H01L / ; H01L / ;
U.S. Cl.
CPC ...
357 79 ; 357 81 ; 357 74 ;
Abstract
A flat-pack type semiconductor device has an anode buffer plate (50) on a semiconductor element (1). The anode buffer plate consists of a central position (51) and a plurality of arms (61, 63) extending therefrom. Each of the arms has a straight portion (61a) placed on a guide ring (70) and a hooked-portion (61b) inserted in the gap (73) between the guide ring and an insulating cylinder (10).
Niwayama, Kazuhiko. (1992). Semiconductor device and method of manufacturing the same (U.S. Patent No. 5121189). U.S. Patent and Trademark Office. https://idiyas.com/patent/badge/5121189
Data source: USPTO (United States Patent and Trademark Office) public patent records. Weekly synchronization. How IDiyas builds this profile