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The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.

The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.

Patent No.:

US 5120665 B1

PDFFull Text
Date of Patent:
Jun. 09, 1992

Filed:

Mar. 19, 1991

Method of using an anisotropically electroconductive adhesive having

Applicant:
Inventors:

Isao Tsukagoshi, Shimodate, JP;

Yutaka Yamaguchi, Yuki, JP;

Atsuo Nakajima, Ibaraki, JP;

Yasushi Goto, Shimodate, JP;

Assignee:

Hitachi Chemical Company, Tokyo, JP;

Attorney:

Antonelli, Terry, Stout & Kraus

Primary Examiner:

Olik Chaudhuri

Assistant Examiner:

David E Graybill

Int. Cl.
CPC ...
H01L / ; H01L / ; H01L / ; H01L / ;
U.S. Cl.
CPC ...
437-8 ; 437209 ; 437211 ;
Abstract

A composition comprising (A) an epoxy resin type adhesive, (B) particles obtained by coating a nucleus of a curing agent with a film, (C) pressure-deformable electroconductive particles having an average particle size larger than that of the particles (B), and if necessary (D) rigid particles having an average particle size smaller than that of the particles (B). Also, a method of using for the composition connecting circuits electrically or connecting a semiconductor chip to a wiring substrate.

Find Patent Forward Citations

Tsukagoshi, Isao. (1992). Method of using an anisotropically electroconductive adhesive having (U.S. Patent No. 5120665). U.S. Patent and Trademark Office. https://idiyas.com/patent/badge/5120665

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