The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.

The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.

Date of Patent:
Jun. 02, 1992

Filed:

Aug. 24, 1990
Applicant:
Inventors:

Yoshiki Sano, Kashihara, JP;

Yoshinori Ogawa, Kita-Katsuragi, JP;

Assignee:
Attorney:
Primary Examiner:
Int. Cl.
CPC ...
H01G / ; H01L / ;
U.S. Cl.
CPC ...
361311 ; 357 51 ;
Abstract

A capacitor having a semiconductor substrate with a diffusion layer disposed in a portion of the semiconductor substrate and a first insulation layer disposed on the semiconductor substrate and the diffusion layer, the capacitor capable of providing a capacitance stably for an integrated circuit includes a first metallic layer disposed on the diffusion layer for conducting an electric current therethrough with the first insulation layer between the semiconductor substrate, a second insulation layer disposed on the first metallic layer for insulating the first metallic layer, and a second metallic layer disposed on the second insulation layer for conducting an electric current therethrough, the capacitance being expressed by C with a relation of C=C.sub.M +C.sub.B, the C.sub.M representing a capacitance occurred between the first metallic layer and the second metallic layer, the C.sub.B representing a capacitance occurred between the first metallic layer and the semiconductor substrate, respectively. The capacitor includes a third metallic layer which is disposed on the diffusion layer for conducting an electric current therethrough, and a third insulation layer which is disposed on the second metallic layer for protecting the integrated circuit. The capacitor also includes a mold resin which is disposed on the third insulation layer for sealing the capacitor.


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