The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.
The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.
Patent No.:
Date of Patent:
Jun. 02, 1992
Filed:
Sep. 27, 1989
Applicant:
Inventor:
Hiroyuki Misawa, Tokyo, JP;
Assignee:
NEC Corporation, Tokyo, JP;
Attorney:
Primary Examiner:
Assistant Examiner:
Int. Cl.
CPC ...
H01L / ; H01L / ;
U.S. Cl.
CPC ...
357 68 ; 357 45 ; 357 71 ;
Abstract
A power supply wiring arrangement of a semiconductor integrated circuit formed on a semiconductor chip, including a plurality of pairs of metal bumps formed on the semiconductor chip, a plurality of conductor strips each extending between the bumps forming each of the pairs of metal bumps, and a plurality of thick-layer wiring strips directly connected to selected ones of the metal bumps and the conductor strips, the thick-layer wiring strips being substantially identical in material and in thickness to the metal bumps.