The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.
The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.
Patent No.:
Date of Patent:
Jun. 02, 1992
Filed:
Aug. 28, 1990
Applicant:
Inventors:
Kazuhiro Ogawa, Nishinomiya, JP;
Yuichi Komizo, Nishinomiya, JP;
Assignee:
Sumitomo Metal Industries, Ltd., Osaka, JP;
Attorney:
Primary Examiner:
Assistant Examiner:
Int. Cl.
CPC ...
B23K / ;
U.S. Cl.
CPC ...
228194 ; 22826315 ;
Abstract
A diffusion bonding method for corrosion resistant materials comprises: disposing an insert material having a melting point of at most 1150 degrees C. and a thickness of 10-80 micrometers between the bonding interfaces of two members to be joined, the insert comprising, by weight %,
Quick Actions:
Ogawa, Kazuhiro. (1992). Diffusion bonding method for corrosion-resistant materials (U.S. Patent No. 5118028). U.S. Patent and Trademark Office. https://idiyas.com/patent/badge/5118028
Data source: USPTO (United States Patent and Trademark Office) public patent records. Weekly synchronization. How IDiyas builds this profile