The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.

The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.

Date of Patent:
May. 26, 1992

Filed:

Dec. 06, 1990
Applicant:
Inventors:

Thomas O Leyh, Bridgeport, WV (US);

Walter A Boyce, Fairmont, WV (US);

Assignee:

North American Philips Corp., New York, NY (US);

Attorney:
Primary Examiner:
Assistant Examiner:
Int. Cl.
CPC ...
H01J / ; H01J / ;
U.S. Cl.
CPC ...
315 73 ; 315 74 ; 315100 ; 315D / ; 313 51 ; 313623 ;
Abstract

A rapid start fluorescent lamp having an improved hot restarting time. The lamp includes the standard envelope and end cap through which electrical connection is made by conductive feedthroughs which extend through the lamp stem to the interior of the lamp. One of the feedthroughs is connected to the cathode, and the other is connected to the leads of a fuse element which is contained within an envelope to isolate the fusible element from the lamp environment. A thermally activated bimetallic element is disposed across the leads of the fuse. The other lead of the fusible element is connected to the other end of the cathode. When the bimetal element is cold, it will bridge the connection between the other feedthrough to the other end of the cathode to permit rapid starting. When the bimetal heats up, the connection of both ends of the cathode to the heating current is broken. The location of the bimetallic element within the lamp envelope but not in the fuse container permits it to open and close more rapidly. Additionally the fuse assembly is utilized as part of the supporting structure for the filament assembly.


Find Patent Forward Citations

Loading…