The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.
The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.
Patent No.:
Date of Patent:
May. 26, 1992
Filed:
Oct. 23, 1989
Jitsumi Shinmoto, Tokyo, JP;
Abstract
A method of providing uniform thickness of a synthetic resin film upon molding of the synthetic resin film with a die having a plurality of heating elements arranged adjacent a die lip of the die. The thickness of a film molded by the die is measured by cutting a sample of the molded film in a direction perpendicular to the direction of drawing of the film, and measuring the thickness of the sample in the direction of cutting with a film thickness measuring device. The measured values are then fed to an arithmetic unit. At the arithmetic unit, a corresponding relationship is calculated, based on the measured film thickness values, between a one-sided material portion of the film and the plurality of heating elements, and amounts of heat to be generated by the corresponding heating elements are individually controlled in accordance with the relationship.