The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.
The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.
Patent No.:
Date of Patent:
May. 12, 1992
Filed:
Apr. 25, 1991
Muvaffak S Acarlar, Allentown, PA (US);
Louis T Manzione, Summit, NJ (US);
Steven D Robinson, Lower Macungie Township, Lehigh County, PA (US);
Dennis Stefanik, Weisenberg Township, Lehigh County, PA (US);
AT&T Bell Laboratories, Murray Hill, NJ (US);
Abstract
An optical communication arrangement is disclosed which utilizes a combination of leadframe and package molding technology to reduce the complexity of the arrangement. In general, a leadframe is utilized for the placement and connection of the required electronic circuitry. A first molding operation is then performed to encapsulate the electronics. If necessary, a metallic plate may then be attached to the housed electronics to provide EMI shielding. An optical device is then coupled to the leadframe, where a separate subassembly may be used to house the optical device. The encapsulated electronics and optics are then simultaneously covered during a second molding operation to form the final package. In one embodiment, an optical subassembly incorporating a connector receptacle may be utilized, where the second molding operation is performed such that the connector receptacle remains exposed. Alternatively, the molded outer package may be configured to include the connector receptacle.