The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.
The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.
Patent No.:
Date of Patent:
May. 12, 1992
Filed:
Jan. 24, 1991
Richard L Wheeler, San Jose, CA (US);
Voddarahalli K Nagesh, Cupertino, CA (US);
Hewlett-Packard Company, Palo Alto, CA (US);
Abstract
An electronic component assembly and method for enhancing density and operational speed. The assembly includes a plurality of integrated circuit chips which are mounted to a planar surface of a substrate, preferably a printed circuit board, with the opposed major faces of the chips being perpendicular to the planar surface. One of the major faces of each chip is the active face having a pattern of signal pads. The pads are disposed along the face periphery adjacent to the edge of the chip contacting the printed circuit board. The signal pads have solder bumps which can be soldered directly to contact pads on the printed circuit board. A passivating edge-coating on each chip protects the chip and prevents electrical shorting on the printed circuit board. A source of fluid directs a cooling flow along the large area major surfaces of the chips.