The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.

The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.

Date of Patent:
May. 12, 1992

Filed:

Mar. 20, 1991
Applicant:
Inventor:

Robert L Goldberg, Sharon, MA (US);

Assignee:

Shipley Company Inc., Newton, MA (US);

Attorney:
Primary Examiner:
Int. Cl.
CPC ...
B44C / ; H01L / ; C23F / ; B29C / ;
U.S. Cl.
CPC ...
156628 ; 156643 ; 156655 ; 156656 ; 156657 ; 1566591 ; 156662 ; 156668 ; 427 431 ; 427 531 ; 427 98 ;
Abstract

This invention describes methods for altering a substrate in a fine line image pattern using microlithographic processes including formation of a metal mask over a polymer coating to protect the coating during dry development of the same. A substrate is first coated with a polymer suitable for complexing noble metal compounds. The substrate is then complexed with a noble metal compound, such as by contact with a palladium salt, selectively irradiated to form the desired conductor pattern, and then etched so that the desired pattern remains. The substrate is subsequently placed in an electroless plating bath to form a metal mask. Alternatively, before applying the noble metal compound, a substrate immersed in a polymer solution suitable for complexing a noble metal compound can be selectively irradiated to selectively deposit polymer on the substrate, followed by applying a noble metal compound and electroless plating to form the desired mask.


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