The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.
The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.
Patent No.:
Date of Patent:
May. 12, 1992
Filed:
Oct. 22, 1990
Robert A Clawson, Kokomo, IN (US);
John R Thome, Fort Worth, TX (US);
Motorola, Inc., Schaumburg, IL (US);
Abstract
The need for solder paste or wave soldering to assemble printed circuit boards and components is eliminated by applying (100) a layer of solder to the exposed metal pads, annular rings and plated through holes of the printed circuit board. Leadless components are placed into a layer of `tack` flux applied (110) to the printed circuit board (120). The printed circuit board is heated to reflow (130) leadless components, and the solder in the holes is melted (140). The leads of the leaded components are heated (150) and inserted (160) into the molten solder in the holes. The assembly is then cooled (170) to solidify the solder around the component.