The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.
The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.
Patent No.:
Date of Patent:
May. 05, 1992
Filed:
Aug. 14, 1990
Hironobu Narui, Kanagawa, JP;
Hiroshi Yoshimatsu, Kanagawa, JP;
Shoji Hirata, Kanagawa, JP;
Masafumi Ozawa, Kanagawa, JP;
Yoshifumi Mori, Chiba, JP;
Sony Corporation, Tokyo, JP;
Abstract
A semiconductor laser comprises a semiconductor substrate provided in its major surface with a strip mesa, and a laminated structure constructed by sequentially forming, through the epitaxial deposition of semiconductor materials on the major surface of the semiconductor substrate, at least a first semiconductor layer serving as a first conduction type cladding layer, a second semiconductor layer serving as an active layer, a third semiconductor layer serving as a second conduction type cladding layer, and a fourth semiconductor layer serving as a light absorbing or current blocking layer by utilizing the crystallographic principle and the characteristics of the steps formed by the strip mesa so that faults are formed in the laminated structure so as to extend along the direction of extension of the opposite longitudinal side surfaces of the strip mesa. The second semiconductor layer is split by the faults so that a portion of the second semiconductor layer between the faults in a portion of the laminated structure extending on the strip mesa forms a strip active layer. The semiconductor layers are formed sequentially by a continuous metal organic chemical vapor deposition process at a growth rate not higher than about 4 .ANG./sec.