Method and apparatus for automatically bonding film to a substrate and

Abstract

An apparatus for bonding a thin film to the surface of a substrate wherein the film is supplied from a continuous roll to a bonding position where a roller applies heat and pressure to cause the film to be bonded to the substrate. A rotary cutter rapidly cuts the continuous film to a length which fits precisely over the substrate. The cutter comprises a stationary knife and a rotary knife which are disposed on opposite sides of the continuous film. The knives are moveable between a cutting position and a non cutting position and are adjustable to provide in the cutting position a rapid cut of the film transversed to the direction of film travel. The apparatus is operative to hold the leading edge of the film, direct the leading edge to a bonding position at the leading edge of the substrate, hold the film in tension as the film is pressure bonded to the substrate and further hold the film in tension for cutting to its appropriate length.