The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.

The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.

Date of Patent:
May. 05, 1992

Filed:

Feb. 19, 1991
Applicant:
Inventors:

John F Jasinski, New Freedom, PA (US);

Robert P McCormick, Seven Valleys, PA (US);

Ricky C Mellinger, Seven Valleys, PA (US);

James K Draper, Winston Salem, NC (US);

Navin N Vyas, Winston Salem, NC (US);

Assignee:

AMP Incorporated, Harrisburg, PA (US);

Attorney:
Primary Examiner:
Assistant Examiner:
Int. Cl.
CPC ...
B32B / ; B65C / ;
U.S. Cl.
CPC ...
156222 ; 1562726 ; 1562733 ; 1563099 ; 156321 ; 156322 ; 156324 ; 156332 ; 174 / ;
Abstract

The present invention discloses a method for laminating at least two polymer films. An intermediate assembly 40 is made comprising an adhesive film 20 and a dielectric polymer film 12. The method comprises the steps of: selecting an adhesive film 20 with a melting point T.sub.1, the adhesive film having inner and outer major surfaces 22, 24; selecting a polymer film 12, with a melting point T.sub.2, where T.sub.2 >T.sub.1, the polymer film having inner and outer major surfaces 14, 16; subjecting the inner surface 14 of the polymer film 12 to a high voltage electric discharge to form a treated inner surface; heating the polymer film 12 having the treated inner surface to a temperature greater than T.sub.1 ; aligning the inner adhesive surface 22 and the inner treated polymer surface 14 in opposed facing relationship; applying pressure to urge the films 12, 20 relatively together; and heating the pressed together films to a temperature greater than T.sub.1 ; whereby the adhesive film 20 adheres to the polymer film 12 to form the intermediate laminated assembly 40. The intermediate assembly 40 is bondable to another substrate 28 to form a resultant laminated assembly 42, which may be formed into an article such as connector 44 wherein the intermediate laminate 40 remains assuredly bonded to substrate 28.


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