The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.
The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.
Patent No.:
Date of Patent:
May. 05, 1992
Filed:
Feb. 28, 1990
James L Gates, Vista, CA (US);
Hughes Aircraft Company, Los Angeles, CA (US);
Abstract
A pair of elongated rectangular metallic bumps are formed on two separate surfaces. The bumps are aligned orthogonally prior to being merged by hybridization to form a high density hybrid assembly. Translational misalignment does not change the interconnect area. Rotational misalignment causes only a slight change in the interconnect area. The bump surface area is increased by merging the bumps. This reduces the hybridization pressure which prevents the interconnect area from increasing in size, commonly known as mash out. The invention makes high density hybrid assemblies practical because it reduces the risk of short circuits between adjacent interconnects and results in a high yield in production.