The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.
The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.
Patent No.:
Date of Patent:
Apr. 28, 1992
Filed:
Feb. 06, 1990
Applicant:
Inventors:
Chun S Wang, Lake Jackson, TX (US);
Douglas G Kleweno, Lake Jackson, TX (US);
Assignee:
The Dow Chemical Company, Midland, MI (US);
Attorney:
Primary Examiner:
Int. Cl.
CPC ...
B32B / ;
U.S. Cl.
CPC ...
428 76 ; 525101 ; 525105 ; 525501 ;
Abstract
Epoxy resins have been reacted with a copolymer of a diunsaturated aliphatic compound and acrylonitrile or methacrylonitrile and a siloxane-containing polymer resulting in a rubber modified epoxy resin suitable for use in electrical and electronic component encapsulation formulations which provide such components with improved thermal shock performance. The rubber modified epoxy resins have improved flexural properties with minimal reduction in glass transition temperature.
Wang, Chun. (1992). Rubber modified epoxy resins (U.S. Patent No. 5108824). U.S. Patent and Trademark Office. https://idiyas.com/patent/badge/5108824
Data source: USPTO (United States Patent and Trademark Office) public patent records. Weekly synchronization. How IDiyas builds this profile