The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.

The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.

Date of Patent:
Apr. 28, 1992

Filed:

Jan. 28, 1991
Applicant:
Inventors:

William G Pitt, Provo, UT (US);

John E Lakenan, LaPlace, LA (US);

Assignee:

Brigham Young University, Provo, UT (US);

Attorney:
Primary Examiner:
Int. Cl.
CPC ...
B05D / ;
U.S. Cl.
CPC ...
427 40 ; 118 501 ; 1562726 ; 427 41 ; 427322 ;
Abstract

A device and method for enhancing adhesion between an embedded filler component and surrounding thermoplastic matrix which together form a composite material. The filler component is subjected to plasma discharge and subsequently maintained in an inert environment to protect the treated surface area against premature exposure to reactive substances. While maintained in this inert environment, the treated surface is coated with a thermoplastic polymer and solidified. This coated filler is then capable of processing into composite materials. The device comprises an enclosure which is adapted which includes a containment space and environment control for maintaining inert conditions during application of plasma discharge and coating with thermoplastic polymer.


Find Patent Forward Citations

Pitt, William. (1992). Enhanced thermoplastic adhesion to fibers by using plasma discharge (U.S. Patent No. 5108780). U.S. Patent and Trademark Office. https://idiyas.com/patent/badge/5108780

Data source: USPTO (United States Patent and Trademark Office) public patent records. Weekly synchronization. How IDiyas builds this profile

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