The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.
The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.
Patent No.:
Date of Patent:
Apr. 28, 1992
Filed:
Apr. 12, 1991
Applicant:
Inventors:
David J Warner, Northampton, GB;
Kim L Pickering, Northampton, GB;
David J Pedder, Warwickshire, GB;
Assignee:
GEC-Marconi Limited, Stanmore, GB;
Primary Examiner:
Int. Cl.
CPC ...
B23K / ;
U.S. Cl.
CPC ...
228254 ; 22826312 ; 437192 ;
Abstract
A flip-chip solder bonding arrangement including a semiconductor substrate having thereon layers of metallization which have a tendency to interact with a solder material, forming on said layers of metallization a barrier metallization layer which is not reactive with said solder material, forming solder pads on the barrier layer and thereafter forming solder bonds with such solder pads employing said solder material.