The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.

The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.

Date of Patent:
Apr. 21, 1992

Filed:

Nov. 01, 1990
Applicant:
Inventors:

George R Allardyce, Nuneaton, GB;

Anthony J Davies, Nuneaton, GB;

David J Wayness, Brownsover, GB;

Amrik Singh, Hillfields, GB;

Assignee:

Shipley Company Inc., Newton, MA (US);

Attorneys:
Primary Examiner:
Int. Cl.
CPC ...
B44C / ; C23F / ;
U.S. Cl.
CPC ...
156629 ; 156633 ; 156634 ; 156656 ; 156667 ; 156902 ; 134-3 ; 252 792 ; 252 794 ;
Abstract

Process for at least partially dissolving a copper oxide surface layer by contacting the surface layer with one or more copper oxide dissolving compounds. When used in the manufacture of a multilayer printed circuit board, the process improves adhesion between board layers, reduces or eliminates localized delamination of a multilayer board that occurs during through-hole drilling, and eliminates or substantially reduces the occurrence of pink ring.


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Allardyce, George. (1992). Process for multilayer printed circuit board manufacture (U.S. Patent No. 5106454). U.S. Patent and Trademark Office. https://idiyas.com/patent/badge/5106454

Data source: USPTO (United States Patent and Trademark Office) public patent records. Weekly synchronization. How IDiyas builds this profile

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