The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.
The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.
Patent No.:
Date of Patent:
Apr. 14, 1992
Filed:
Sep. 13, 1989
Susumu Honda, Tokyo, JP;
Takahiko Sugihara, Kanagawa, JP;
Taizo Igarashi, Hyogo, JP;
Keiji Hirao, Hyogo, JP;
Hisamichi Matsuda, Hyogo, JP;
Nippon Oil & Fats Co., Ltd., Tokyo, JP;
Abstract
A synthetic resin composition comprising 100 parts by weight of a synthetic resin, from 2 to 900 parts by weight of an inorganic filler, and from 0.02 to 20 parts by weight of a copolymer of a compound represented by formula (1) and maleic anhydride, maleic acid, a maleic acid salt or a maleic acid ester; ##STR1## wherein Z is a residue of a compound having from 2 to 8 hydroxyl groups; AO is an oxyalkylene group having from 2 to 18 carbon atoms; R.sup.1 is an unsaturated hydrocarbon group having from 2 to 5 carbon atoms; R.sup.2 is a hydrocarbon or acyl group having from 1 to 40 carbon; a is from 0 to 1,000, b is from 0 to 1,000, c is from 0 to 1,000, l is an integer of from 1 to 8, m is an integer of from 0 to 2, and n is an integer of from 0 to 7, l+m+n=2 to 8, al+bm+cn=1 to 1,000, and n/(l+n).ltoreq.1/3. In the synthetic resin composition the inorganic filler is uniformly dispersed in the synthetic resin with good efficiency at molding to give excellent molding characteristics and mechanical characteristics.