The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.
The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.
Patent No.:
Date of Patent:
Apr. 07, 1992
Filed:
Feb. 06, 1990
Peter J Brady, Glendale, AZ (US);
Square D Company, Palatine, IL (US);
Abstract
A dual SIP package for encapsulating a plurality of semiconductor die includes a first group of elongated metal leads each having first and second end portions, and a first group of enlarged metal pads each attached to the first end portion of one of the leads of the first group, a second group of elongated metal leads each having first and second end portions, and a second group of enlarged metal pads each attached to the first end portion of one of the leads of the second group, each of the pads of the first group being parallel to and aligned with a corresponding pad of the second group to form a pair. The first end portion of each of the leads of the first group is parallel to and aligned with the first end portion of a lead of the second group. Each of the die is disposed between and connected to a pair of the pads. The bottom electrode of each die is attached to a pad of the first group, and the top electrode of each die is attached to a pad of the second group. Plastic encapsulation surrounds the die, the first group of pads, and the first end portion of each of the leads of the first and second groups. The second end portion of each lead of the first and second groups extends beyond the encapsulation.