The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.
The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.
Patent No.:
Date of Patent:
Apr. 07, 1992
Filed:
Sep. 24, 1990
Larry R Hite, Dallas, TX (US);
Other;
Abstract
An integrated circuit package is disclosed which has decoupling capacitors mounted within the cavity. A first embodiment has a thin-film capacitor mounted to the die attach of the header, with a first wire bond connecting the top surface to a lead finger of the header, and with a second wire bond connecting the top surface to the semiconductor chip mounted in the package. A second embodiment allows for decoupling of the power supply to a reference voltage other than that of the substrate, by providing a stacked capacitor where the top capacitor has a smaller cross-sectional area than the lower capacitor. Bond wires connect the top surface of the top capacitor to a first power supply lead, such as V.sub.cc, and to the V.sub.cc bond pad of the chip. The top surface of the lower capacitor, and consequently the lower surface of the top capacitor, are connected by bond wires to the reference supply (V.sub.ss) lead of the package and bond pad of the chip.