The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.

The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.

Date of Patent:
Apr. 07, 1992

Filed:

May. 14, 1990
Applicant:
Inventors:

Tsutomu Maruyama, Hiratsuka, JP;

Kiyotake Fukawa, Hiratsuka, JP;

Yutaka Yoshikawa, Hiratsuka, JP;

Kiichi Mori, Hiratsuka, JP;

Atsushi Akiyama, Hiratsuka, JP;

Assignee:

Kansai Paint Co., Ltd., Amagasaki, JP;

Attorney:
Primary Examiner:
Assistant Examiner:
Int. Cl.
CPC ...
H05K / ; C25D / ;
U.S. Cl.
CPC ...
2041806 ; 1566591 ; 156902 ; 2041802 ; 430313 ; 430318 ;
Abstract

Disclosed is an improved process for preparing a printed-circuit board, which comprises successive steps of electrodeposition coating of a photosensitive resin on a printed-circuit base plate to form a photosensitive resist film, exposure to light through a pattern mask, development and etching, the improvement further comprising a step of dipping the photosensitive resist film formed by electrodeposition coating into an aqueous solution comprising water as a major component and applying a voltage to carry out electroendosmosis, whereby the tendency of the photosensitive resist film to stick to the pattern mask is reduced.


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