The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.
The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.
Patent No.:
Date of Patent:
Mar. 31, 1992
Filed:
Aug. 24, 1990
Sebastian S Plamthottam, Pasadena, CA (US);
Earl W McFeaters, La Crescenta, CA (US);
Yehuda Ozari, Arcadia, CA (US);
Prakash Mallya, Pasadena, CA (US);
Avery Dennison Corporation, Pasadena, CA (US);
Abstract
A pressure sensitive adhesive tape comprises a carrier layer having a thickness of 0.25 to 2.0 millimeter and comprising an electron beam cured pressure sensitive adhesive matrix, 10 to 20% by volume low density microspheres and at least one pigment in an amount sufficient to color the tape. Preferably, fumed silica is present in an amount up to 5% by weight. The tape preferably has a kin layer on each side of the carrier layer. The skin layer has a coating thickness of 25 to 125 g/m.sup.2 and comprises a pressure sensitive adhesive matrix free of rigid, low density microspheres. The process comprises first preparing an adhesive composition containing electron beam-curable adhesive polymer matrix, fillers and solvent. The composition is introduced and conveyed through a twin screw extruder. In the extruder, solvent is removed in one or more solvent removal units, and a solvent-free composition is extruded as the carried layer. Skin layers may be co-extruded with the carrier layer.