The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.

The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.

Date of Patent:
Mar. 24, 1992

Filed:

Mar. 25, 1991
Applicant:
Inventors:

James R Bentlage, Binghamton, NY (US);

David E Engle, Vestal, NY (US);

Geoffrey R Mariner, Apalachin, NY (US);

John J Squires, Endicott, NY (US);

John H Williams, Endicott, NY (US);

Attorney:
Primary Examiner:
Assistant Examiner:
Int. Cl.
CPC ...
H01R / ; H01R / ;
U.S. Cl.
CPC ...
361413 ; 361400 ; 361398 ; 439 67 ; 439 73 ; 439 77 ; 439 84 ; 439248 ; 439493 ; 174 524 ;
Abstract

An electronic package including a first circuitized substrate (e.g., printed circuit board) and a flexible circuitized substrate wherein the flexible substrate is precisely aligned in removable manner relative to the first substrate. This is accomplished utilizing a retention member and associated frame member, the flexible circuitized substrate being precisely aligned and secured to the frame member. Elastomeric pressure exertion members are utilized to exert pressure against each of a plurality of individual circuitized sections of the flexible circuit member to thus effect engagement between the flexible substrate's contacts and respective conductors which constitute part of the circuit on the first substrate. Moveable clamp members may also be used to engage extending posts of the retention member, said clamp members also possibly acting against a stiffener member located on the first substrate's opposite surface from the flexible substrate.


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