The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.
The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.
Patent No.:
Date of Patent:
Mar. 24, 1992
Filed:
Oct. 16, 1990
Mikio Nakai, Shizuoka, JP;
Yoshiharu Suzuki, Chiba, JP;
Polyplastics Co., Ltd., Osaka, JP;
Abstract
An integrally molded article for use in circuit formation is provided by use of a two-shot injection molding procedure. A previously molded primary thermoplastic resin composition is pretreated for plating and a specifically defined secondary thermoplastic resin composition having a melt viscosity of 200 P. or below is injection molded about preselected portions of the primary molding which are not intended to bear a circuit. Such secondary thermoplastic resin composition comprises an anisotropic melt-forming polyester having a weight average molecular weight of 10,000 or below and a particulate inorganic filler. Excellent adhesion between the primary and secondary thermoplastic resins is achieved.