The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.
The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.
Patent No.:
Date of Patent:
Mar. 24, 1992
Filed:
Jul. 10, 1990
David G Shaw, Glens Falls, NY (US);
Angelo Yializis, South Glens Falls, NY (US);
Donald S Strycker, Glens Falls, NY (US);
Mooyoung Ham, Glens Falls, NY (US);
Spectrum Control, Inc., Erie, PA (US);
Abstract
A high speed apparatus for forming capacitors includes a vacuum chamber in which is located a carrier defining a continuous surface configured to move at a rate of from about 150 feet per minute to about 600 feet per minute during the forming operation, a metal depositing device, a dielectric depositing device, and a radiation source. The metal depositing device is configured to deposit layers of metal onto the moving surface, and the dielectric depositing device includes (a) a device for atomizing a radiation-curable polyfunctional acrylic monomer to form liquid droplets of the monomer, (b) a heated surface on which the atomized monomer droplets impinge and are flash vaporized, and (c) device for thereafter condensing the flash-vaporized monomer on the metal layers to form a monomer coating on successive layers. The radiation source is positioned for curing successive monomer coatings after each such coating has been deposited, to thereby form a polymer dielectric layer. Apparatus are provided for controlling each of the devices so that metal is deposited, a monomer coating is deposited, and the monomer coating is cured to form the polymer dielectric layer before the continuous surface passes the devices again for successive metal layers, monomer coatings, and curings.