The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.

The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.

Date of Patent:
Mar. 17, 1992

Filed:

Jan. 25, 1991
Applicant:
Inventor:

Jeffery E Jackson, Kirkland, WA (US);

Assignee:

Sundstrand Data Control, Inc., Redmond, WA (US);

Attorney:
Primary Examiner:
Int. Cl.
CPC ...
H01R / ; H01R / ;
U.S. Cl.
CPC ...
174 / ; 29843 ; 1741262 ; 219 5622 ; 228-45 ; 228179 ; 439887 ;
Abstract

A lightweight, substantially corrosion-proof, conductive wire and terminal assembly (10) comprising a wire (12) laid on and welded to a terminal pad (18) at or near the end (16) of the wire. The wire (12) has an electrically conductive core (24) having a cylindrical surface. The cylindrical surface is substantially completely enveloped in a sheath of noble metal plating (26, 28). The terminal pad (18) has a noble metal surface where it is welded to the cylindrical surface of the wire (12), so the joint (22) formed by the weld is substantially sheathed in a noble metal, and thus is substantially as corrosion-proof as the noble metal sheath (26, 28) and terminal pad (18). The wire (12) is preferably covered with insulation (30) except at its end (16), which may be stripped. This invention has the advantage that the joint (22) does not require a post-plating operation after the wire and terminal pad (18) are welded together, yet the joint (22) is stronger than a joint between dissimilar metals such as copper wire (12) and a gold terminal pad (18) and substantially as corrosion-proof as the plating (26, 28). A method for forming the assembly (10) is also disclosed.


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