The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.

The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.

Date of Patent:
Mar. 17, 1992

Filed:

Nov. 27, 1990
Applicant:
Inventors:

Hitoshi Yuasa, Yokohama, JP;

Eiji Yoda, Yokohama, JP;

Haruyoshi Sato, Kawasaki, JP;

Yutaka Otsuki, Yokohama, JP;

Assignee:
Attorney:
Primary Examiner:
Assistant Examiner:
Int. Cl.
CPC ...
G03C / ; C08F / ;
U.S. Cl.
CPC ...
430286 ; 430287 ; 430281 ; 522 95 ; 522102 ; 522106 ;
Abstract

A resin composition for forming a durable protection coating contains (A) an alkali-soluble resin which is a polymer of a conjugated diene and has a monoamidated succinic acid group represented by the following formula (I) of: ##STR1## wherein R.sup.1 and R.sup.2 each stand for a hydrogen atom, a halogen atom or an organic residue having 1 to 3 carbon atoms; and R.sup.3 stands for an organic residue having 1 to 16 carbon atoms; (B) a pre-polymer having a photosensitive ethylenic double bond; and (C) a photopolymerization initiator. The mixing ratio by weight of the alkali-soluble resin (A) to the pre-polymer (B) ranges from 1:4 to 4:1. A process for preparing the durable protection coating contains applying the resin composition on a substrate, and exposing the resin composition to ultraviolet ray through a circuit pattern mask to cure the resin composition followed by development and after-curing to form the protection coating.


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