The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.
The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.
Patent No.:
Date of Patent:
Mar. 10, 1992
Filed:
Oct. 03, 1990
Toshiaki Suzuki, Aizuwakamatsu, JP;
Yoji Murakami, Aizuwakamatsu, JP;
Masao Kobayashi, Aizuwakamatsu, JP;
Osamu Yamauchi, Aizuwakamatsu, JP;
Fujitsu Limited, Kawasaki, JP;
Abstract
A lead frame includes an outside frame portion having an central opening, and a rectangular mount portion supported by the outside frame portion and disposed within the central opening, and on which an electronic element is adapted to be mounted. The lead frame also includes at least one lead element array disposed along a side of the mount portion, respectively, the lead elements included in the array being connected to each other by a common tie bar element, and at least two expandable tie bar elements extending between the outside frame portion and each of the lead element arrays to support each lead element array by the outside frame portion, each of the expandable tie bar elements including a shaped portion which can be expanded by a deformation thereof. In a method of producing an electronic component using the lead frame, a process of bending the lead elements is performed before an electrolytic-plating process thereof.