The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.
The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.
Patent No.:
Date of Patent:
Mar. 03, 1992
Filed:
Apr. 06, 1989
Applicant:
Inventor:
Taizo Eshima, Fukuoka, JP;
Assignee:
Attorney:
Primary Examiner:
Assistant Examiner:
Int. Cl.
CPC ...
H01L / ; B29C / ;
U.S. Cl.
CPC ...
437217 ; 437207 ; 437219 ; 26427217 ; 361421 ; 174 522 ;
Abstract
In a method for manufacturing semiconductor devices, to a case main body are bonded leads each having an inner end on the inner side of a side edge of the case main body and an outer end on the outer side of the side edge. A semiconductor chip is electrically connected to the inner ends of the leads on the case main body. Subsequently, a lid is adhesively bonded to the case main body. Accordingly, it is possible to reduce the total time period required to manufacture each semiconductor device and to enhance the reliability and yield of semiconductor devices.