The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.

The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.

Date of Patent:
Mar. 03, 1992

Filed:

Jul. 25, 1989
Applicant:
Inventor:

John W Tully, Rolling Hills Estates, CA (US);

Assignee:

Northrop Corporation, Los Angeles, CA (US);

Attorneys:
Primary Examiner:
Assistant Examiner:
Int. Cl.
CPC ...
H01L / ;
U.S. Cl.
CPC ...
437184 ; 437189 ; 437192 ; 437 22 ; 437912 ; 437944 ; 437 80 ; 148D / ; 148D / ;
Abstract

A process for forming refractory metal ohmic contacts comprises masking a group III-V semiconductor substrate and opening windows thereon. Metal ions are implanted through the window to a sufficient concentration to connect to electronic features in the substrate. Following implantation, a refractory metal ohmic contact is deposited in the same windows and is passivated. Next, the implanted ions are activated by annealing so the refractory metal ohmic contacts are electrically connected to the electrical features in the substrate.


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