The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.
The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.
Patent No.:
Date of Patent:
Feb. 25, 1992
Filed:
May. 17, 1990
Applicant:
Inventors:
Assignee:
Kabushiki Kaisha Toshiba, Kawasaki, JP;
Attorney:
Primary Examiner:
Assistant Examiner:
Int. Cl.
CPC ...
H01L / ; H01L / ; H01L / ; H01L / ;
U.S. Cl.
CPC ...
437212 ; 437214 ; 437220 ; 437902 ; 357 81 ;
Abstract
A method of sealing a semiconductor device with resin includes the steps of coupling the tie bar of a lead frame to a heat sink; die bonding a semiconductor chip to the surface of the heat sink; wire bonding and electrically connecting the semiconductor chip to leads of the lead frame; placing the heat sink on the bottom surface of a cavity of a lower mold, putting an upper mold on the lower mold, and pressing down the coupling portion between the heat sink and lead frame toward the bottom surface by using a pressure member mounted on the upper mold; and injecting melted resin within the cavity defined by the upper and lower molds, and hardening the resin.