The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.

The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.

Date of Patent:
Feb. 25, 1992

Filed:

Jun. 26, 1990
Applicant:
Inventors:

Shoji Hanamura, Kodaira, JP;

Masaaki Aoki, Minato, JP;

Toshiaki Masuhara, Nishitama, JP;

Assignee:

Hitachi, Ltd., Tokyo, JP;

Attorney:
Primary Examiner:
Assistant Examiner:
Int. Cl.
CPC ...
H01L / ; H01L / ;
U.S. Cl.
CPC ...
437 40 ; 437 41 ; 437 57 ; 437101 ; 437937 ;
Abstract

Electric charge is supplied to a circuit node being in a charge storing state within a signal processor in response to a signal-processing commencing signal. The processor is operated in a low-temperature range, for example, in the range of temperature below 200K. By this structure, a leakage current is reduced, a high degree of integration equivalent to that of a dynamic circuit can be obtained, and the simplicity of a static circuit not requiring any complicated internal/external timing signals can be realized. Also disclosed is a semiconductor device, and method of forming such semiconductor device, for operation in a range of temperatures below 100.degree. K. The device has, in a silicon surface region where the channel of the device is formed, a low impurity concentration layer (between the source and drain regions of the device). Such low impurity concentration layer is formed by evaporating amorphous silicon on a surface region of a semiconductor region of the device and passing the device through a low-temperature annealing process, the low impurity concentration layer having a lower total impurity concentration than that of the semiconductor region thereunder and having a thickness not more than 100 nm.


Find Patent Forward Citations

Loading…