The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.

The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.

Date of Patent:
Feb. 25, 1992

Filed:

Mar. 27, 1990
Applicant:
Inventors:

Isamu Tanaka, Yokosuka, JP;

Hitoshi Oka, Yokohama, JP;

Makio Watanabe, Fujisawa, JP;

Hiroshi Kikuchi, Zushi, JP;

Shinichiro Imabayashi, Yokohama, JP;

Yukihiro Taniguti, Chigasaki, JP;

Assignee:

Hitachi, Ltd., Tokyo, JP;

Attorney:
Primary Examiner:
Assistant Examiner:
Int. Cl.
CPC ...
G03F / ;
U.S. Cl.
CPC ...
430280 ; 430288 ; 430918 ; 430286 ;
Abstract

A photo curable diallyl phthalate resin composition characterized by containing 0.1 to 10 parts by weight of an agent for preventing back side undesirable curing and 20 to 100 parts by weight of a filler per 100 parts by weight of a diallyl phthalate prepolymer is particularly suitable for a partly additive process for forming a solder resist effective for preventing back side undesirable curing by ultraviolet light and having resistance to release of substances from the solder resist for deteriorating properties of plated copper film as well as for giving good mechanical properties.


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