The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.
The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.
Patent No.:
Date of Patent:
Feb. 25, 1992
Filed:
Aug. 16, 1990
Leonard F Altman, Coral Springs, FL (US);
Dale W Dorinski, Coral Springs, FL (US);
Motorola, Inc., Schaumburg, IL (US);
Abstract
A method of producing a metallized pattern on a substrate includes the steps of providing a substrate having a high aspect ratio groove defining a desired metallization pattern and applying metallization to the substrate. The high aspect ratio groove is utilized to prevent metallization across the groove boundary thereby producing electrically isolated areas. The substrate can be a circuit board, hybrid module or other component carrying structure. Also the substrate can be a resonator or a stripline device in which the groove is used to electrially isolate a lead or wire extending from the substrate in the ground plane portion of the structure.