The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.
The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.
Patent No.:
Date of Patent:
Feb. 18, 1992
Filed:
Mar. 11, 1991
Applicant:
Inventor:
Kazuichi Komenaka, Kawasaki, JP;
Assignee:
Kabushiki Kaisha Toshiba, Kawasaki, JP;
Attorney:
Primary Examiner:
Int. Cl.
CPC ...
H01L / ;
U.S. Cl.
CPC ...
357 72 ; 357 70 ; 357 69 ;
Abstract
A resin seal type semiconductor device comprises a lead frame having a support and a plurality of leads, a semiconductor chip mounted on the die support and having a plurality of pads connected to the leads. Furthermore, the device has a wire lead arranged above the semiconductor chip. For example, power source is supplied from the lead supplying power source to one of the pads receiving power source, by connecting the lead and the one pad. Furthermore, power source is supplied from the lead to another pad located far from the one pad by connecting the lead and the another pad through the wire lead.