The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.
The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.
Patent No.:
Date of Patent:
Feb. 18, 1992
Filed:
Feb. 15, 1990
Sho Masujima, Tokyo, JP;
Hiroshi Yagi, Tokyo, JP;
Atsuzo Tamashima, Tokyo, JP;
Masakazu Kamoshida, Tokyo, JP;
TDK Corporation, Tokyo, JP;
Abstract
A carrier tape for electronic circuit elements adapted to be provisionally held on printed circuit boards prior to fixing of them on said printed circuit boards by soldering, comprises a flexible tape body extending in a longitudinal direction, and adhesive means applied with respect to the tape body and for serving the purpose of provisionally holding of electronic circuit elements on printed circuit boards, the adhesive means being formed of a material which exhibits adhesion upon being heated. The adhesive means is formed of a polymeric material which exhibits adhesion upon being heated. The carrier tape further includes electronic circuit elements held with respect to the tape body at equal intervals in a row in the longitudinal direction of the tape body through the adhesive means, thereby constituting an electronic circuit element series. When respective electronic circuit elements are removed from the electronic circuit element series, the adhesive means sticking to the respective electronic circuit elements are adapted to be also removed from the series. The adhesive means sticking to the respective electronic circuit elements are then heated, through which adhesive means have exhibited adhesion due to heating the respective electronic circuit elements are provisionally held on a printed circuit board. Also, a method of manufacturing an electronic circuit element series is disclosed.