The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.
The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.
Patent No.:
Date of Patent:
Feb. 11, 1992
Filed:
Apr. 04, 1991
Applicant:
Inventor:
Carl Missele, Elgin, IL (US);
Assignee:
Motorola, Inc., Schaumburg, IL (US);
Attorneys:
Primary Examiner:
Int. Cl.
CPC ...
H05K / ;
U.S. Cl.
CPC ...
361386 ; 165185 ; 228248 ; 337232 ; 361403 ;
Abstract
An improved interconnection for mounting an electrical component to a substrate, such as a printed circuit board or the like, comprises an interwoven copper film mat embedded within a solder alloy matrix. The solder alloy is bonded to the component and to the substrate and extends continuously therebetween to provide a strong mechanical joint. The copper mat enhances electrical and thermal conductivity through the interconnection and improves compliant to relieve stresses of the type generated by differential thermal expansion of the component and the substrate during use.