The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.
The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.
Patent No.:
Date of Patent:
Feb. 11, 1992
Filed:
Feb. 20, 1990
Applicant:
Inventors:
Jon Long, Livermore, CA (US);
Rachel S Sidorovsky, San Jose, CA (US);
Assignee:
LSI Logic Corporation, Milpitas, CA (US);
Primary Examiner:
Assistant Examiner:
Int. Cl.
CPC ...
H01L / ; H01L / ; H01L / ;
U.S. Cl.
CPC ...
357 69 ; 357 70 ; 357 72 ; 357 80 ; 174 524 ;
Abstract
A semiconductor device assembly is made without a molded package by using a tape having a patterned insulating layer and a conductive layer joined thereto. A semiconductor die is seated on the conductive layer and electrically connected to leads of the patterned conductive layer. A body frame is positioned around the die and electrical leads and connections, and an encapsulant material is distributed over the frame and within the frame over the die and electrical leads and connections.
Long, Jon. (1992). Semiconductor device package (U.S. Patent No. 5087961). U.S. Patent and Trademark Office. https://idiyas.com/patent/badge/5087961
Data source: USPTO (United States Patent and Trademark Office) public patent records. Weekly synchronization. How IDiyas builds this profile