The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.

The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.

Date of Patent:
Feb. 11, 1992

Filed:

Jun. 10, 1991
Applicant:
Inventor:

Hiroshi Toi, Kanagawa, JP;

Assignee:

Sony Corporation, Tokyo, JP;

Attorneys:
Primary Examiner:
Int. Cl.
CPC ...
B23P / ;
U.S. Cl.
CPC ...
29740 ; 29705 ; 29720 ; 36457105 ; 901 46 ;
Abstract

An electronic component mounting apparatus wherein any unflatness value such as skew at each of predetermined points on the surface of a substrate supported at a component mounting position is measured by a non-contact type measuring instrument. Such unflatness value and a predetermined height of each electronic component to be mounted are calculated, and the descent stroke of each suction nozzle is adjusted in accordance with the result of such calculation in such a manner that the bottom face of the component is set exactly at the predetermined position on the substrate surface, thereby ensuring accurate mounting of the component on the substrate surface without causing any impact thereto to consequently attain proper attachment.


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