The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.
The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.
Patent No.:
Date of Patent:
Feb. 04, 1992
Filed:
May. 19, 1989
Yoshikatsu Satake, Iwaki, JP;
Takashi Kaneko, Iwaki, JP;
Yutaka Kobayashi, Iwaki, JP;
Yukio Ichikawa, Iwaki, JP;
Yo Iizuka, Iwaki, JP;
Makoto Fukuda, Kasukabe, JP;
Toshio Enoki, Iwaki, JP;
Takayuki Katto, Iwaki, JP;
Yasuo Sakaguchi, Iwaki, JP;
Zenya Shiiki, Iwaki, JP;
Kureha Kabaku Kogyo K.K., , JP;
Abstract
Heat-resistant resin composition including (A) 100 parts by weight of a poly(arylene sulfide) of a substantially linear structure containing 50% by weight or higher or recurring units of the formula ##STR1## and a logarithmic viscosity number of 0.1 to 1.0 dl/g; (B) from 0.01 to less than 25 parts by weight of a melt-stable poly(arylene thioether-ketone) having predominant recurring units of the formula ##STR2## wherein the --CO-- and --S-- are in the para position to each other, and having a melting point of 310.degree.-380.degree. C., a residual melt crystallization enthalpy of at least 10 J/g, a melt crystallization temperature of at least 210.degree. C. and a reduced viscosity of 0.2 to 2 dl/g; and (C) at least one of fibrous fibers and/or at least one of inorganic fillers in a proportion of 0 to 400 parts by weight per 100 parts by weight of the resin component including said poly(arylene sulfide) and said poly(arylene thioether-ketone). Heat-resistant articles obtained by melt-molding or forming said resin compositions and a method for the production of such articles are also described.