The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.
The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.
Patent No.:
Date of Patent:
Feb. 04, 1992
Filed:
Dec. 19, 1990
Applicant:
Inventors:
Makoto Kamiyama, Kanuma, JP;
Shigeo Nakada, Kanuma, JP;
Kouji Ikeda, Utsunomiya, JP;
Hiroshi Usui, Kanuma, JP;
Kazutoshi Sasaki, Kanuma, JP;
Hiroshi Yamamoto, Utsunomiya, JP;
Assignee:
JSP Corporation, Tokyo, JP;
Attorney:
Primary Examiner:
Int. Cl.
CPC ...
B29C / ; B29C / ;
U.S. Cl.
CPC ...
264126 ; 264321 ; 264335 ; 425 / ;
Abstract
An expansion-molded article is produced by filling prefoamed thermoplastic particles in a mold cavity formed in combination of mold sections, through each of which plural heating medium holes are defined, and then feeding a heating medium such as steam through the holes to heat and fusion-bond the particles into the article conforming with the mold cavity. Each of the mold sections is covered by a permeable porous sheet at least over the heating medium on a side of the mold cavity.