The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.
The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.
Patent No.:
Date of Patent:
Jan. 28, 1992
Filed:
Feb. 01, 1990
Applicant:
Inventors:
Assignee:
Somar Corporation, , JP;
Attorney:
Primary Examiner:
Assistant Examiner:
Int. Cl.
CPC ...
C08L / ;
U.S. Cl.
CPC ...
525423 ; 523428 ; 523429 ;
Abstract
An epoxy resin bonding composition containing two different epoxy resin as a liquid admixture, a curing agent and a polyamide powder is disclosed. The bonding composition may be used, for example, to bond a ferrite magnetic to a motor yoke. One of the epoxy resins is an unmodified glycidyl ether of bisphenol A, bisphenol F or bisphenol AD. The other epoxy resin is an urethane-modified or glycol-modified glycidyl ether of bisphenol A, bisphenol F or bisphenol AD. The polyamide powder has an average particle size of 150 .mu.m or less and a melting of at least 170.degree. C. and is present in an amount 1-50 parts by weight per 100 parts by weight of liquid epoxy resin admixture.