The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.
The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.
Patent No.:
Date of Patent:
Jan. 21, 1992
Filed:
Sep. 19, 1990
Tito Gelsomini, Reiti, IT;
Texas Instruments Incorporated, Dallas, TX (US);
Abstract
A pair of like, semiconductor integrated circuit dies, such as DRAMS, have second level bonding pads formed over their active surfaces in mirror images of one another. The dies then become bonded to opposite sides of frame bonding pads of a lead frame to double the capacity of a normally encapsulated integrated circuit. The normal die bonding pads of the circuit dies are arranged identical to one another, and a patterned and etched second level of metal forms second level lands over the die bonding pads, the mirror image second level bonding pads and second level leads connecting corresponding second level lands to second level pads. A pair of 256K DRAMS can be connected either 256K.times.2 or 512K.times.1 by use of dummy second level pads for DATA-IN/OUT and ROW ADDRESSES STROBE connections.