The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.
The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.
Patent No.:
Date of Patent:
Jan. 21, 1992
Filed:
Sep. 17, 1990
Yutaka Sadano, Kimitsu, JP;
Yuuji Nakashima, Kimitsu, JP;
Takashi Tanaka, Sagamihara, JP;
Takatoshi Kawasaki, Tokyo, JP;
Shinji Shibata, Toyota, JP;
Hikaru Aoyagi, Tokyo, JP;
Yoshio Nishizawa, Tokyo, JP;
Akihiko Kasahara, Tokyo, JP;
Nippon Steel Corporation, Tokyo, JP;
Toyota Jidosha Kabushiki Kaisha, Toyota, JP;
Nippon Kinzoku Co., Ltd., Tokyo, JP;
Abstract
When soldering a honeycomb body formed by alternately piling flat foils (plates) and corrugated foils (plates), a binder liquid is sucked up from the end face of the honeycomb body to form a binder streak in a space defined by contacting portions of the flat foil (plate) and corrugated foil (plate), a solder is scattered and applied onto the binder streak, and the honeycomb body is then dried and heated to effect a soldering of the honeycomb body. According to this method, soldering can be accomplished only in the vicinity of the contacting portions of the flat foil (plate) and corrugated foil (plate), with a desired soldering structure.