The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.
The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.
Patent No.:
Date of Patent:
Jan. 07, 1992
Filed:
Jul. 16, 1989
Applicant:
Inventors:
Iwao Hisamoto, Suita, JP;
Masayoshi Shinjyo, Settsu, JP;
Seiji Takubo, Settsu, JP;
Yasuko Katakura, Yamatokooriyama, JP;
Assignee:
Daikin Industries, Ltd., Osaka, JP;
Attorney:
Primary Examiner:
Int. Cl.
CPC ...
C08F / ;
U.S. Cl.
CPC ...
525100 ; 524130 ; 524131 ; 524132 ; 524133 ; 524135 ; 524136 ; 524139 ; 524140 ; 524141 ; 524142 ; 524149 ; 524198 ; 524199 ; 524 89 ; 524 91 ; 525104 ; 525403 ; 525410 ; 525440 ; 525447 ; 525476 ; 525479 ; 525453 ; 525460 ; 525101 ;
Abstract
This invention provides a mold release composition copmrising (1) a compound or a polymer having at least one of perfluoroalkyl groups having 4 to 20 carbon atoms and perfluoroalkenyl groups having 4 to 20 carbon atoms, and (2) a ladder polymer of organosilsesquioxane.